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Editorial Board
Editor-in-Chief
- Luc Vandendorpe Université Catholique de Louvain, Belgium
Associate Editors
- T D Abhayapala Australian National University, Australia
- Farid Ahmed Johns Hopkins University Applied Physics Laboratory, United States of America
- Mohamed Hossam Ahmed Memorial University of Newfoundland, Canada
- Carles Anton-Haro Centre Tecnològic de Telecomunicacions de Catalunya (CTTC), Spain
- Mohamad Assaad SUPÉLEC, France
- Gildas Avoine Université catholique de Louvain, Belgium
- A C Boucouvalas University of Peloponnese, Greece
- Yuh Shyan Chen National Taipei University, Taiwan
- Pascal Chevalier Thalès-Communications, France
- Chia-Chin Chong DoCoMo USA Labs, Republic of Korea
- Daniel Benevides da Costa Federal University of Ceara, Brazil
- S Dasgupta University of Iowa, United States of America
- Rodrigo C De Lamare University of York, United Kingdom
- Richard Demo Souza Federal University of Technology - Paraná, Brazil
- Ibrahim Develi Erciyes University, Turkey
- Petar M Djuric Stony Brook University, United States of America
- Michael Gastpar University of California, United States of America
- Wolfgang H Gerstacker University of Erlangen Nuremberg, Germany
- Zabih Ghassemlooy The University of Northumbria at Newcastle, United Kingdom
- Filippo Giannetti University of Pisa, Italy
- Jean-marie Gorce Institut National des Sciences Appliquées de Lyon, France
- Maxime Guillaud Vienna University of Technology, Austria
- Jeroen Hoebeke Ghent University, Belgium
- Yongming Huang Southeast University, China
- Chi Chung Ko National University of Singapore, Singapore
- Nicholas Kolokotronis University of Peloponnese, Greece
- Marios Kountouris SUPELEC, France
- Richard Kozick Bucknell University, United States of America
- Sangarapillai Lambotharan Loughborough University, United Kingdom
- Vincent Lau Hong Kong University of Science and Technology, Hong Kong
- D I Laurenson University of Edinburgh, United Kingdom
- Tho Le-Ngoc McGill University, Canada
- Wei Li Texas Southern University, United States of America
- Lingjia Liu Samsung Electronics, United States of America
- Zhiqiang Liu US Naval Research Laboratory, United States of America
- Stephen McLaughlin University of Edinburgh, United Kingdom
- Sudip Misra Indian Institute of Technology Kharagpur, India
- I Moerman Ghent University, Belgium
- Sayandev Mukherjee DOCOMO Communications Laboratories USA, Inc., United States of America
- Kameswara Rao Namaduri University of North Texas, United States of America
- Amiya Nayak University of Ottawa, Canada
- Monica Nicoli Politecnico di Milano, Italy
- Claude Oestges Université catholique de Louvain, Belgium
- Ashish Pandharipande Philips Research, The Netherlands
- Jordi Pérez-Romero Universitat Politècnica de Catalunya (UPC), Spain
- Phillip Regalia Institut National des Télécommunications, France
- Heidi Steendam University of Ghent, Belgium
- Stefano Tomasin University of Padova, Italy
- George S Tombras University of Athens, Greece
- Athanasios V Vasilakos National Technical University of Athens, Greece
- Ping Wang Nanyang Technological University, Canada
- Tao Wang Universite Catholique de Louvain, Belgium
- Weidong Xiang University of Michigan, United States of America
- Kwan L Yeung The University of Hong Kong, Hong Kong
- Fei Richard Yu Carleton University, Canada
- W H Zhuang University of Waterloo, Canada
